| 摘要 |
PROBLEM TO BE SOLVED: To arrange a wafer horizontally by making grooves of identical height distinguishable easily. SOLUTION: The wafer cassette comprises a pair of sidewalls 11a and 11b constituting a housing having an open front surface, a plurality of grooves 3 formed on the pair of sidewalls, respectively, and a pair of sensors 5a and 5b arranged in the vicinity of the pair of sidewalls and detecting the insertion of the wafer into the groove. COPYRIGHT: (C)2006,JPO&NCIPI |
