| 摘要 |
PROBLEM TO BE SOLVED: To achieve miniaturization of the whole device and its mass production, to reduce manufacturing cost, to improve reliability of the device itself, and to lengthen its service life. SOLUTION: A passage 11 by a groove penetrating from one end face to the other end face is formed on the surface of a silicon substrate 12, and a light receiving element 22 is buried in a state where the light receiving surface is exposed to the inside of the passage 11, and a light source 24 is interfitted into a light source hole 23 on the side wall of the passage 11 so that outgoing light in not irradiated directly onto the light receiving surface but passes over the light receiving surface. In addition, the upper side of the silicon substrate 12 is blocked with a silicon substrate 13 and fixed therewith, so that the upper side of the passage 11 is blocked, to thereby acquire the air passage 11 having both open ends. COPYRIGHT: (C)2006,JPO&NCIPI
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