| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for analyzing the influence of a contact resistance with terminals in a semiconductor integrated circuit. SOLUTION: A fixture 40 having an IC socket 20 on which a semiconductor integrated circuit chip can be mounted, a conductive route connectable to terminals in the semiconductor circuit chip mounted on the IC socket, and a resistor provided on the way of the conductive route, is prepared; the electric characteristics of the semiconductor integrated circuit chip are measured under the state where the resistor is intervened on the way of the conductive route; the above resistor is replaced by a resistor with a different resistance value, and then the electric characteristics of the semiconductor circuit chip are measured while the resistor is intervened on the way of the conductive route; and based on these measurement results the effect to the contact resistance with the terminals in the semiconductor integrated circuit, is analyzed. Thus, the effect of the contact resistance between a probe needle and a pad in the probing inspection of a wafer containing a semiconductor integrated circuit equivalent to the semiconductor integrated circuit. COPYRIGHT: (C)2006,JPO&NCIPI
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