| 摘要 |
PROBLEM TO BE SOLVED: To easily form a recessed part shallower than that by ordinary etching according to isotropic etching. SOLUTION: At first, a first resist film and a second resist film are formed on the main face of a substrate (step S11). Successively, exposure and development are performed, a plurality of first openings discretely arranged so as to be a dot shape are formed in a first etching starting region on the first resist film, and a second opening as a perfect opening is formed in a second etching starting region (steps S12, S13). Then, the substrate is subjected to isotropic etching, and a first recessed part and a second recessed part are formed on the lower parts of the first openings and the second opening (step S14). Thereafter, the first resist film and the second resist film are removed from the substrate (step S15). In a first recessed part schedule region, a new etching liquid is hard to flow into the recessed part, and further, the etching liquid in the recessed part is hard to flow out compared with the case of a second recessed part schedule region. As a result, the first recessed part shallower than the second recessed part is formed. COPYRIGHT: (C)2006,JPO&NCIPI
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