| 摘要 |
A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a circuitized member; sandwiching the members together, forming a cavity therein; bonding adhesively the members together with heat and pressure; bonding adhesively a chip to the support member within the cavity; and connecting electrically the chip to the circuitized member. A process for fabricating an electronic flip chip package, including the steps of fabricating an adhesive bonding member, a flip chip, and a circuitized member; aligning the members with respect to each other; sandwiching the members together; bonding the members together with heat and pressure; and connecting electrically the flip chip to the circuitized member.
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