发明名称 Package structure of light-emitting device
摘要 A package structure of light-emitting device comprises a substrate. Two lines are formed on the substrate. An insulating layer is formed between two lines. A plurality of light-emitting sources are formed on the substrate for generating the light. Each light-emitting source has a positive electrode and a negative electrode. A plurality of leading wires are respectively connected to two lines from the positive electrode and the negative electrode of the light-emitting source to form an electrical connection.
申请公布号 US2006081833(A1) 申请公布日期 2006.04.20
申请号 US20050296452 申请日期 2005.12.08
申请人 发明人 PENG YU-CHIN;CHEN YA-LI
分类号 H01L29/06;H01L23/28;H01L25/075;H01L33/46 主分类号 H01L29/06
代理机构 代理人
主权项
地址