| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a polyamideimide film with circuit board metal, which can inexpensively manufacture the polyamideimide film with metal, where a conductor layer is stuck to the polyamideimide film with high adhesion strength, by comparatively small number of processes without using a special material. SOLUTION: The polyamideimide film including inorganic fill is processed by alkaline permanganic acid solution. Non-electrolytic copper plating is performed or non-electrolytic copper plating and electrolytic copper plating are sequentially performed. It is preferable that alkaline permanganic acid solution is potassium permanganate solution or sodium permanganate solution. COPYRIGHT: (C)2006,JPO&NCIPI |
