| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder material which has a small coefficient of volume expansion in a heated and molten state, and further to provide an electronic component which can suppress a failure in remelting the material using the solder material, and further to provide a method for manufacturing the electronic component. SOLUTION: The solder material is composed by mixing a solder composition 41 and metallic powder which is composed of a metal 43 having a solidus temperature higher than that of the solder composition 41 at least in its inside portion. When the solder composition has been melted, the metallic powder does not melt and disperses in the molten solder composition, Therefore, the solder composition is less than the apparent quantity by the content of the metallic powder. As a result, the level of the volume expansion of the solder material in the molten state becomes small. For this reason, even when an electronic component, having such a structure that surface mounting components have been mounted and sealed on a wiring substrate, has been heated, the intrusion of the solder material into the interface between the wiring substrate having the surface mounting components thereon and the sealing material is suppressed, and the failure due to a short circuit, etc. can be prevented. COPYRIGHT: (C)2006,JPO&NCIPI
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