发明名称 |
Chip Scale Package with Micro Antenna and Method for Manufacturing the same |
摘要 |
A chip scale package with micro antenna includes a chip, a first dielectric layer and an antenna. The chip has an active surface, a first bonding pad and a second bonding pad on the active surface. The first dielectric layer is formed on the active surface of the chip. The first dielectric layer has a plurality of openings to expose the first bonding pad and the second bonding pad. Each of the openings has an expanding inclined sidewall. The antenna is formed on the upper surface of the first dielectric layer and connected to the first bonding pad and the second bonding pad through the inclined sidewall of the openings for preventing antenna cracking.
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申请公布号 |
US2006081982(A1) |
申请公布日期 |
2006.04.20 |
申请号 |
US20050163133 |
申请日期 |
2005.10.06 |
申请人 |
HUANG MIN-LUNG;WU TSUNG-HUA |
发明人 |
HUANG MIN-LUNG;WU TSUNG-HUA |
分类号 |
H01L23/48;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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