| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in adhesion properties with an epoxy resin using a cyclic olefin based resin constituent that is superior in low stress properties, solvent-resisting properties, water absorption properties, electrical insulating properties, adhesion properties, heat-resisting properties, or the like. SOLUTION: The semiconductor device comprises a cyclic olefin based resin (A) having an acidic group on a support body, a photo acid generator (B), and a resin film containing a compound (C) having a reaction group capable of combining to the acidic group of the cyclic olefin based resin (A) at a temperature of 130°C or over. The resin film is oxygen-plasma-processed, and the support body is sealed using an epoxy sealing resin. COPYRIGHT: (C)2006,JPO&NCIPI |
