发明名称 CONDUCTIVE PASTE FOR FORMING CONDUCTIVE SECTION FOR FERRITE MULTILAYER CIRCUIT BOARD AND FERRITE MULTILAYER CIRCUIT BOARD USING CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide conductive paste for forming a conductive section for a ferrite multilayer circuit board having the excellent bonding strength and conductivity of an obtained conductor and having the small warp of a substrate after baking in the case of simultaneous baking with a ferrite green sheet. SOLUTION: Conductor powder coating Ag powder with at least one kind of an inorganic oxide selected from Sn0<SB>2</SB>or Si0<SB>2</SB>is dispersed in an organic vehicle. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108399(A) 申请公布日期 2006.04.20
申请号 JP20040293186 申请日期 2004.10.06
申请人 KYOTO ELEX KK 发明人 OGURA SHINICHI;OCHI HIROSHI;MIYOSHI HIROMASA
分类号 H05K3/46;H01B1/00;H01B1/22;H05K1/09 主分类号 H05K3/46
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