发明名称 |
CONDUCTIVE PASTE FOR FORMING CONDUCTIVE SECTION FOR FERRITE MULTILAYER CIRCUIT BOARD AND FERRITE MULTILAYER CIRCUIT BOARD USING CONDUCTIVE PASTE |
摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste for forming a conductive section for a ferrite multilayer circuit board having the excellent bonding strength and conductivity of an obtained conductor and having the small warp of a substrate after baking in the case of simultaneous baking with a ferrite green sheet. SOLUTION: Conductor powder coating Ag powder with at least one kind of an inorganic oxide selected from Sn0<SB>2</SB>or Si0<SB>2</SB>is dispersed in an organic vehicle. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006108399(A) |
申请公布日期 |
2006.04.20 |
申请号 |
JP20040293186 |
申请日期 |
2004.10.06 |
申请人 |
KYOTO ELEX KK |
发明人 |
OGURA SHINICHI;OCHI HIROSHI;MIYOSHI HIROMASA |
分类号 |
H05K3/46;H01B1/00;H01B1/22;H05K1/09 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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