| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive fine particles having a low connection resistance value and excellent conduction reliability; and to provide an anisotropic conductive material using the conductive fine particles and having a low connection resistance value and excellent conduction reliability. SOLUTION: These conductive fine particles are formed by applying metal plating to surfaces of composite fine particles made by joining, to surfaces of nonconductive fine particles A, nonconductive fine particles B smaller than the nonconductive fine particles A. In the conductive fine particles, a compressive elasticity modulus obtained by compressively deforming the conductive fine particles by 10% (10% K value) is 5,000-8,500 N/mm<SP>2</SP>; and a compressive elasticity modulus obtained by compressively deforming them by 30% (30% K value) is 1,500-3,000 N/mm<SP>2</SP>. In the conductive fine particles, it is preferable that the nonconductive fine particles A are formed of crosslinked resin fine particles; and the nonconductive fine particles B are formed of non-crosslinked resin fine particles. This anisotropic conductive material is formed by dispersing the conductive fine particles in a resin binder. COPYRIGHT: (C)2006,JPO&NCIPI
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