| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame in which adhesion can be enhanced at the contact portion of a lead and sealing resin and thereby reliability of a semiconductor package can be enhanced, and to provide a semiconductor package employing it. <P>SOLUTION: At the lead portion 14 of a lead frame, one end 21 is extended in the longitudinal direction and the width direction on the surface 21a side as an extension part 22, and a recess 23 is formed in the surface of the extension part 22 on the dam bar side. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
