METAL PLATED BOARD, MANUFACTURING METHOD THEREOF, FLEXIBLE PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a metal plated board along with a flexible printed wiring board and multilayer printed wiring board using the same, which is bendable and excellent in dimension stability, circuit forming property, and conductor peeling resistance. SOLUTION: The fabric substrate of a thermo-setting adhesive sheet is impregnated with an adhesive composition of which elasticity of curing material is 500-7,000 MPa (measured according to ASTM D-882). A plating coat is formed at least one surface of the sheet, which is thermally cured to provide a metal plated board. The flexible printed wiring board uses the metal plated board. The multilayer printed wiring board is obtained by integrally jointing layers on which a circuit is formed to an inner layer circuit board through the adhesive sheet using the metal plated board. COPYRIGHT: (C)2006,JPO&NCIPI