| 摘要 |
PROBLEM TO BE SOLVED: To make a resin molding without causing flashes and allowing deformation of the molding when an easily-deformable molding object such as a film substrate used for manufacturing a semiconductor device of a BOC (board on chip) type is clamped by a mold to make the resin molding. SOLUTION: The resin mold device comprises an upper mold 30 and a lower mold 40 one of which molds is provided with air suction holes 45 and 46. The molding object 20 is sucked on the mold face through the air suction holes 45 and 46, the molding object 20 is clamped by the mold 30 and the mold 40, and in this state, a resin is filled into cavities 32a and 42a formed in the mold 30 and the mold 40 from a pot 41 to make the resin molding. The air suction hole 46 opposed in a region of the cavity 32a of the other mold of the mold 30 and the mold 40 communicates with an air suction device, and a suction pin 47 is inserted in an air hole formed in a single hole shape opened in a mold face to suck and retain the molding object 20. COPYRIGHT: (C)2006,JPO&NCIPI |
