| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the device, in which the production process can be simplified and the production cost can be reduced, as compared to prior art. SOLUTION: A one-side copper-foil resin sheet is made contact with and laminated on each of both front and back surfaces of the semiconductor substrate 1 provided with through holes 4, with a resin surface of the sheet kept in contact with each of both surfaces of the substrate 1, and the inner surface of the through hole 4 and both surfaces of the semiconductor substrate 1 are covered with an insulating resin layer 5, formed by laminating one-side copper-foil resin sheets. Outside the insulating resin layer 5, in addition, there are formed wiring layers 6, each having a double-layer structure made up of a copper foil pattern layer and a copper plated layer formed thereon. Furthermore, a post 7 made of electrically conductive material, such as copper, is formed on the insulating resin layer 5 in the inside of the through hole 4 so as to electrically connect the wiring layers on both surfaces of the semiconductor substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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