| 摘要 |
PROBLEM TO BE SOLVED: To provide a slicing device to cut a plate into slices. SOLUTION: The slicing device is structured so that a decoration plate W is transported in the condition that the cutting edge of a cutting blade 7 is heaved up along a crack S1, as shown in Fig. (1). In association with the transport of the decoration plate W, the crack S1 proceeds along with the transport of the decoration plate W bit by bit to the boundary between melamine resin Wb and a board Wa in such a way as splitting bamboo, as shown in Fig. (2), and slicing is performed in such a manner that the melamine resin Wb is peeled off from the board Wa. COPYRIGHT: (C)2006,JPO&NCIPI
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