发明名称 Conductive adhesive composition
摘要 Aspects of the invention can provide a conductive adhesive composition which can include a compound represented by the following general formula (1): wherein X<SUP>1</SUP>, X<SUP>2</SUP>, X<SUP>3 </SUP>and X<SUP>4</SUP>, each independently represent a hydrogen atom or a straight-chain alkyl group, which may be the same or different; however, at least one of X<SUP>1</SUP>, X<SUP>2</SUP>, X<SUP>3 </SUP>and X<SUP>4 </SUP>represents a straight-chain alkyl group having carbon number of 3 to 8, and the rest represents a hydrogen atom, a methyl group or an ethyl group; also, R at eight positions each independently represents a hydrogen atom, a methyl group or an ethyl group, which may be the same or different; and Y represents a group including at least one substituted or unsubstituted aromatic hydrocarbon ring.
申请公布号 US2006081817(A1) 申请公布日期 2006.04.20
申请号 US20050235358 申请日期 2005.09.27
申请人 SEIKO EPSON CORPORATION 发明人 SHINOHARA TAKASHI;SHINOHARA YUJI;TERAO KOICHI
分类号 H01B1/12;H01B1/00 主分类号 H01B1/12
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