发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device and a processing method therefor, in which arrangement information is unified and the transfer of mounted components between devices is easy, and which allows efficient arrangement work. <P>SOLUTION: Memory devices of four component mounting devices of 1st to 4th units on one production line are provided with mounting data master 65 (65-1 to 65-4) in which arrangement information 66-1, 66-2, 66-3, and 66-4 are stored for an own device and the other device. If the A-component mounting process allocation of the 1st unit is transferred to the 3rd unit as the production task of the 1st unit is longer than that of the 3rd unit, an operator instructs the 1st unit to transfer the arrangement information of an A-component to the 3rd unit (S101), and instructs the 3rd unit to receive the arrangement information of the A component from the 1st unit (S102). In the 1st unit, the arrangement information of the A-component of the arrangement information 66-1 for the own device of the mounting data master 65-1 is transferred to the arrangement information 66-3 for the 3rd unit. In the 3rd unit, the arrangement information of the A-component of the arrangement information 66-1 for the 1st unit of the mounting data master 65-3 is transferred and stored in the arrangement information 66-3 for the own device. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108320(A) 申请公布日期 2006.04.20
申请号 JP20040291809 申请日期 2004.10.04
申请人 YAMAGATA CASIO CO LTD 发明人 SUZUKI TAKASHI
分类号 H05K13/04 主分类号 H05K13/04
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