| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device that enables the direct-current separation between a semiconductor radiation source and a cooling body and shows improved cooling action by improving a cooling device for the radiation source when manufacturing a press plate. SOLUTION: The radiation source 3 comprising semiconductor substrates 2, 6 is fixed to a metal layer 11 for conducting an actuating current and heat. The metal layer 11 is deposited to an electrically insulating plate 12 that conducts heat. The plate 12 is fixed to the cooling body 14 on a lower surface. The cooling body 14 is made of a material conducting heat. The material has a coefficient of thermal expansion fitted for the semiconductor substrates 2, 6. The cooling body 14 has at least one passage 15. In the passage 15, a cooling liquid 16 is circulated. COPYRIGHT: (C)2006,JPO&NCIPI |
