| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which avoids clearance between the lead frame and sealing resin by closely contacting the lead frame and the sealing resin, and to provide a manufacturing method. SOLUTION: In a lead frame 1 provided with a die pad 2 and leads 3 and 3; a flat surface 7 and its end surface 8 of the die pad 2, and a flat face 7 and its end face 8 of the lead are constituted in a continuous surface. The lead frame surfaces 7 and 8, whose range of the arithmetic average roughness Ra exists between 30 nm or more and 50 nm or less, are formed in a smooth surface and furthermore a surface reforming layer 6 is formed on the smooth surface of the lead frame surface. Consequently, the moisture resistance, adhesiveness and airtightness of the interface are improved between the lead frame and the sealing resin. COPYRIGHT: (C)2006,JPO&NCIPI
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