| 摘要 |
PROBLEM TO BE SOLVED: To preclude a bump of a connection substrate from being crushed, even when a pressing lid and a carrier housing are combined under the condition where no bare chip exists. SOLUTION: This carrier unit 40 includes the carrier housing 46, a contact sheet 44 provided with the bump 44B pressed onto an electrode group of the stored bare chips by a pressing body 56, the pressing lid 52, and a latch mechanism 50. The bump 44B is not crushed even under the condition where no bare chip exists, since pressing parts 56wa, 56wb of the pressing body 56 have respectively recesses 56A, 56B inserted with the bump 44B. COPYRIGHT: (C)2006,JPO&NCIPI
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