发明名称 Bi-fold mounted printed wiring board
摘要 A mounted printed wiring board is disclosed that will allow sensors to be installed in optimal positions thereon with the same time and effort needed for one board, and allow the same to be inexpensively manufactured with a simple process. A single board unit includes first and second board portions having a break line interposed therebetween. Sensors and mounted components that are shorter than the sensors are mounted on the first board portion, connectors and mounted components that are taller than the sensors are mounted on the second board portion, and jumper wires are mounted across the first and second board portions. The board unit is then folded in two with the break line so that the mounting surfaces face outward, and the first and second board portions are fixed with spacers.
申请公布号 US2006082985(A1) 申请公布日期 2006.04.20
申请号 US20040963600 申请日期 2004.10.14
申请人 KYOCERA MITA CORPORATION 发明人 NARUSE KENTAROU
分类号 H05K1/14 主分类号 H05K1/14
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