The magnet arrangement (200) and resulting rotating sputtering magnetron design of an embodiment provides magnetic flux density and distribution to penetrate thick production ferrous targets (501). Further, the magnetic field shape improves target life (501) by more uniformly removing target material (501).
申请公布号
WO2005048284(A3)
申请公布日期
2006.04.20
申请号
WO2004US38084
申请日期
2004.11.05
申请人
DEXTER MAGNETIC TECHNOLOGIES, INC.;STELTER, RICHARD, E.;WELK, ARON;PADUA, CHRISTOPHER, T.;LI, CHUN
发明人
STELTER, RICHARD, E.;WELK, ARON;PADUA, CHRISTOPHER, T.;LI, CHUN
