发明名称 NONCONTACT IC LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
摘要 <p>A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.</p>
申请公布号 WO2006041033(A1) 申请公布日期 2006.04.20
申请号 WO2005JP18639 申请日期 2005.10.07
申请人 TOPPAN FORMS CO., LTD.;KAGAYA, HITOSHI;IDE, YOSHIAKI;YAMAKAMI, TAKESHI;OHNO, HIROKI 发明人 KAGAYA, HITOSHI;IDE, YOSHIAKI;YAMAKAMI, TAKESHI;OHNO, HIROKI
分类号 G06K19/077;B42D15/10;G06K19/07;H01F17/00;H01F17/04;H01L21/56;H04B5/02 主分类号 G06K19/077
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