NONCONTACT IC LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
摘要
<p>A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.</p>
申请公布号
WO2006041033(A1)
申请公布日期
2006.04.20
申请号
WO2005JP18639
申请日期
2005.10.07
申请人
TOPPAN FORMS CO., LTD.;KAGAYA, HITOSHI;IDE, YOSHIAKI;YAMAKAMI, TAKESHI;OHNO, HIROKI