| 摘要 |
Processing is started (S1), and control of mounting processes is successively executed by mounting program instructions of a storage section (S2). An electronic component is positioned with respect to a mounting head, taken out, and held (S3). The BGA component is positioned through positional detection of a reference mark and inspection, and the correcting is executed by checking the holding posture. Through the inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subjected to quality check (S4). The normal component is moved closer to the mounting position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6). By determining the mounting position through mounting position detection and component inspection result, the mounting position is corrected (S7) and the height of the mounting head is controlled and mounted (S8). Depending on the presence or absence of the component to be mounted, the program flow proceeds to the process S1 for continuing the processing or to the process S10 for ending (S9), and the processing ends (S10). <IMAGE> |
