| 发明名称 |
ELECTRONIC DEVICE, ASSEMBLY AND METHODS OF MANUFACTURING AN ELECTRONIC DEVICE |
| 摘要 |
A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate. |
| 申请公布号 |
KR20060033866(A) |
申请公布日期 |
2006.04.20 |
| 申请号 |
KR20057024459 |
申请日期 |
2004.06.11 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
ROOZEBOOM FREDDY;BUIJSMAN ADRIANUS A. J.;GAMAND PATRICE;KEMMEREN ANTONIUS L. A. M.;HUBERT GERARDUS T. M. |
| 分类号 |
H01L23/02;H01L21/334;H01L21/768;H01L23/48;H01L27/08;H01L29/06 |
主分类号 |
H01L23/02 |
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