发明名称 MANUFACTURING METHOD FOR ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce the cost of a high-frequency power amplifier by mounting an air-core coil on a wiring board without using a bulk feeder after forming the air-core coil. <P>SOLUTION: A manufacturing method is provided for an electronic device having a power amplifier. The method includes a process (a) of winding a wire rod around a winding jig to form a helical portion, a process (b) of cutting a part of the wiring rod to separate the helical portion away from the wiring rod, a process (c) of pulling the winding jig out of the helical portion to form the air-core coil, and a process (d) of mounting the air-core coil on the wiring board after the process (c). Consequently, the manufacturing method prevents a plurality of air-core coils from being entangled in an entangled state during the processes (c) and (d). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108416(A) 申请公布日期 2006.04.20
申请号 JP20040293472 申请日期 2004.10.06
申请人 RENESAS TECHNOLOGY CORP 发明人 KOZU TADASHI;KOBAYASHI YOSHIHIKO;SATO SUSUMU;TSUKADA KATSUHIKO;ISHIZU AKIO
分类号 H01F41/04;H01F5/00;H01F5/06;H01F17/02;H01F19/04;H01F27/28;H01L25/07;H01L25/18;H05K1/18 主分类号 H01F41/04
代理机构 代理人
主权项
地址