| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a polyimide film with circuit board metal, which can inexpensively manufacture the polyimide film with metal, where a conductor layer is stuck to the polyimide film with high adhesion strength, by comparatively small number of processes without using a special material. SOLUTION: The polyimide film including inorganic fill is processed by alkaline permanganic acid solution. Non-electrolytic copper plating is performed or non-electrolytic copper plating and electrolytic copper plating are sequentially performed. Potassium permanganate solution or sodium permanganate solution is used as alkaline permanganic acid solution. COPYRIGHT: (C)2006,JPO&NCIPI |
