发明名称 OPTICAL MODULE ASSEMBLING DEVICE AND ASSEMBLING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a device or the like which can find an optimum coupling position keeping a light output stable from an optical semiconductor element such as an LD element or the like, and can perform core adjustment and the assembling of a light module in a short time. SOLUTION: The assembling device or the like has a supply device which has a holding arm 1 which holds and moves a package 2 whereon an optical semiconductor element is mounted; a thermistor 6 which is mounted on the holding arm 1 and measures a temperature in contact with the optical semiconductor element; a Peltier element 3 which cools the optical semiconductor element via the holding arm 1; a power supply means 4 for supplying power to the optical semiconductor element and a control means 7 which makes the optical semiconductor element emit light while moving the package 2 by the holding arm 1, and controls it so that the temperature of the optical semiconductor element becomes a prescribed temperature via the thermistor 6 and the Peltier element 3; core adjustment means 17, 18 each performing core adjustment for the supplied optical semiconductor element and the other optical element 10; and a fixing means for fixing the optical semiconductor element and the optical element 10 which are subjected to core adjustment. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108427(A) 申请公布日期 2006.04.20
申请号 JP20040293680 申请日期 2004.10.06
申请人 NEC ENGINEERING LTD 发明人 HORIKAWA TOMOMI
分类号 H01S5/022;G02B6/42 主分类号 H01S5/022
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