| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component pickup method with which pickup work of an electronic component bonded to/held by a carrier can stably be performed with high productivity and to provide electronic component mounting method/device. SOLUTION: In the electronic component pickup method, a holding tool 20 picks up a chip 6 bonded to/held by an adhesion layer 5a of a sheet 5. Adhesive containing compound which generates nitrogen gas is used as the adhesion layer 5a by irradiating ultraviolet rays. In a pickup operation, the holding tool 20 is brought into contact with an upper face of the chip 6 so as to pick up the electronic component in a state where a light irradiation part 8 is positioned below the chip 6 to be picked up, the adhesion layer 5a positioned at a rear side of the chip 6 is irradiated with the ultraviolet rays from a lower side of the sheet 5 and nitrogen gas generated from the adhesion layer 5a forms a gas layer G in a bonding interface of a rear face of the chip 6 and the adhesion layer 5a. COPYRIGHT: (C)2006,JPO&NCIPI |
