| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device for suppressing the increase in a chip area, even if the number of pads is increased. SOLUTION: The semiconductor integrated circuit is provided with an entire surface of the essential surfaces formed with circuit elements constituting an integrated circuit which is used as a circuit area 2, comprising an insulating film formed on the essential surface, an internal wiring layer formed on the insulating film, pads 10 disposed on the insulating film by having them overlapped on the circuit area 2, an input circuit arranged in the circuit area 2, and an opening for electrically connecting the pads 10 formed on the insulating film and the input circuit via the internal wiring layer. Then, an electrical connecting path of the pads 10 to the internal wiring layer is set, by disposing the pads 10 overlapped on the internal wiring layer of the input circuit which is formed by connecting the circuit elements. COPYRIGHT: (C)2006,JPO&NCIPI |
