| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of displacing a semiconductor chip from the center of a cooling fan without making a cooling fan small. SOLUTION: The semiconductor device comprises at least one semiconductor device 2 and a cooling fan 12 for cooling the semiconductor device 2. The center of the cooling fan 12 coincides substantially with the center of a heat spreader 8 with a size almost equal to the semiconductor device. Furthermore, the center of the semiconductor device 2 is displaced with only distance D from the center of the cooling fan 12. COPYRIGHT: (C)2006,JPO&NCIPI |
