| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating apparatus which can easily form a plated film having more uniform thickness on a surface, to be plated, of a material to be plated, and an electroless plating method. SOLUTION: In the plating apparatus comprising a holding portion 10 for holding a material W to be plated, and a plating bath 24 for holding a plating liquid 22, wherein the material W to be plated is brought into contact with the plating liquid 22 in the plating bath 24 to be plated, the holding portion 10 has a heating portion 14. COPYRIGHT: (C)2006,JPO&NCIPI
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