| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor, which hardly deteriorates under ultraviolet radiation. SOLUTION: The epoxy resin composition for sealing the optical semiconductor contains (A) an epoxy resin obtained by subjecting alkoxy-silicon compounds of formula (1): XSi(R<SB>1</SB>)<SB>n</SB>(OR<SB>2</SB>)<SB>3-n</SB>(wherein X is an organic group having an epoxy group; R<SB>1</SB>is a 1-10C alkyl group, an aryl group or a 2-5C alkenyl group; R<SB>2</SB>is a 1-4C alkyl group; and n is an integer of 0-2) or alkoxy-silicon compounds of formula (1) and formula (2): X<SB>k</SB>(R<SB>3</SB>)<SB>m</SB>Si(OR<SB>4</SB>)<SB>4-(k+m)</SB>(wherein X is an organic group having an epoxy group; R<SB>3</SB>is a 1-10C alkyl group, an aryl group or an unsaturated aliphatic residue; k and m are each an integer of 0-3, provided that k+m is 0-3; and R<SB>4</SB>is a 1-4C alkyl group) to co-hydrolysis condensation and (B) a cation polymerization initiator. COPYRIGHT: (C)2006,JPO&NCIPI
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