发明名称 |
Method and apparatus for cleaning and drying wafers |
摘要 |
The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.
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申请公布号 |
US2006081269(A1) |
申请公布日期 |
2006.04.20 |
申请号 |
US20050073687 |
申请日期 |
2005.03.08 |
申请人 |
KIM ONE-VAI;HAN JAE-SUN;BAE JEONG-YONG;CHO JUNG-KEUN |
发明人 |
KIM ONE-VAI;HAN JAE-SUN;BAE JEONG-YONG;CHO JUNG-KEUN |
分类号 |
C23G1/00;H01L21/304;B08B3/00;B08B3/02;B08B3/12;C23G5/00;H01L21/00 |
主分类号 |
C23G1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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