| 摘要 |
A cut via structure for and a manufacturing method of connecting separate conductors are provided. The cut via structure is electrically connected to a substrate. It comprises at least two separate conductors. These conductors form a central-hollow via structure. Alternatively, the central hole can be filled with desired materials (central-filling structure). The conductors are separated by gaps among them. The gaps are formed in a vertically or slantly cut direction with respect to the substrate surface. The cut via structure further comprises a filling layer filled in between the separate conductors. Determined by the material property of the filling layer, the cut via structure can be used as a capacitor or a resistor, or for signal shielding. The cut via structure is made after the formation of a conventional via structure that has no signal shielding effect. This invention has the advantages of low manufacturing cost as well as flexible circuit board design due to its adjustable electrical parameters.
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