SEMICONDUCTOR DEVICE

摘要

There are provided semiconductor devices (1, 1A, 21, 31, 41, 51) including a first semiconductor chip (3) having a first function surface (3F) where a first function element (3a) is formed; a protection resin layer (12) formed on the first function surface; bottom exposing surfaces (10B, 19BB) formed on the periphery of the first function surface and exposed from a bottom surface (12B) located at the side opposite to the first function surface side of the protection resin layer; side exposing surfaces (10S, 19BS) exposed from the side surface (12S) of the protection resin layer; and external connection terminals (10, 19, 52) for electrical connection with outside.