| 摘要 |
PROBLEM TO BE SOLVED: To provide a module substrate where a partial gap is not generated between a substrate and an electronic part. SOLUTION: The module substrate is obtained by soldering the substrate 1 and a semiconductor element 2. In this case a solder layer 3 has a shape consisting of the main body 5 of the same shape as the plane shape of the semiconductor element 2 and a projecting part 4 projecting partially from it. Since projecting of the solder layer 3 is not omnidirectional, positioning in the case of placing has no problem. When the solder layer 3 is melted by raising temperature, bubbles are generated in it. The bubbles moves to the projector 4 where moving out is easy, and moves outside from there. In the case, solder is supplied from the projector 4 to a path through which the bubbles pass. Even with respect to the contraction of the solder layer 3 in the case of cooling, the solder is supplied from the projector 4. Thus, a gap does not remain between the substrate 1 and the semiconductor element 2. COPYRIGHT: (C)2006,JPO&NCIPI
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