| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser apparatus that is capable of easily driving a plurality of semiconductor laser devices and that can be thinned, and to provide an optical pickup apparatus, and an optical recording medium driving apparatus. <P>SOLUTION: A base 110 has a major axis and a minor axis in a YZ plane. A platy heat sink 110S that extends in the X direction is integrally formed at the front bottom of base 110. The heat sink 110S has a mount surface 110d that is parallel with the upper surface 113 and the lower surface 114 of the base 110. One chip semiconductor laser element 1000 is mounted on the mount surface 110d. In the heat sink 110, lead pins made of metal p1 to p5 are sequentially disposed at regular intervals in the Y direction such that they face the heat sink 110S in the Z direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
