| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive sputtering method and apparatus, with which a high-quality deposited film can be obtained extending over a deposition film forming plane. SOLUTION: In the reactive sputtering method, with which a target and a substrate are disposed inside a treatment container, and a reactant of sputtering particles and reaction gases fed into the treatment container is deposited on the substrate, in a space where the sputtering particles fly from the target onto the substrate, a partition is disposed, without being in contact with a deposition film formation plane of the substrate so as to substantially divide the deposition film forming plane of the substrate into a plurality of regions. The reaction gases of a flow rate corresponding to the deposition speed of the sputtering particles are fed, from a reactive gas feeding nozzle which is disposed toward each of the areas divided by the partition inside each of spaces surrounded with the partition, to the deposition film forming plane of the substrate installed in each of the regions divided by the partition. COPYRIGHT: (C)2006,JPO&NCIPI
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