| 摘要 |
PROBLEM TO BE SOLVED: To provide spring devices of equal height, and methods for manufacturing and using such spring devices. SOLUTION: A spring device 150 is composed of a substrate 160, a self-releasing layer 170 formed on the substrate 160, and a stress inherent metal layer 180 formed on the self-releasing layer 170. Using the stress contained in the stressed metal layer 180, a peeling force stronger than the indirect attaching power of the stress inherent metal layer 180 that copes with the self-releasing 170 is generated. The spring device 150 is manufactured so that, based on the stress contained in the stressed metal layer 180, a peeling force stronger than the indirect attaching power of the stressed metal layer 180 that copes with the self-releasing layer 170 is generated, by the method of laying the self-releasing layer 170 on a prepared substrate 160, and the stressed metal layer 180 on the layer 170. COPYRIGHT: (C)2006,JPO&NCIPI |
