摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which can seal electronic parts mounted on a flexible board by a transfer molding without cutting and damaging a wiring pattern and to provide an electronic apparatus using this. SOLUTION: The outer peripheral edges of seals 6a, 6c and 6e and a region near its outer peripheral edges do not have a wiring pattern on the front surface of the flexible board 1 and does not have a wiring pattern between the front surface of the flexible board 1 and a base material 22. The outer peripheral edges of seals 6b, 6d and 6f and a region near the outer peripheral edges do not have a wiring pattern on the front surface of the flexible board 1. Further, it is made that there is no wiring pattern between the front surface of the flexible board 1 and the base material 22. An electrode part provided at the side in which a light emitting element 2, a light receiving element 3 and an IC 4 for a communication of the flexible board 1 are packaged is connected to the electrode part provided at the other surface side of the flexible board 1 through a through hole 12. COPYRIGHT: (C)2006,JPO&NCIPI
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