| 摘要 |
PROBLEM TO BE SOLVED: To provide the high reliability connection structure of a printed wiring board, by preventing short circuitings between patterns due to solder bridges of excess solder. SOLUTION: One end of a copper foil exposed pattern in a surface facing a printed wiring board 100 of copper foil exposed patterns on the printed wiring board 104, which is subjected to soldering connection to the copper foil exposed patterns formed on the printed wiring board 100 is extended to a substrate end, and the other end thereof is formed to be covered with a solder resist 107b to thin the width of a boundary covered with the solder resist 107b with respect to the width of a board end. COPYRIGHT: (C)2006,JPO&NCIPI
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