| 摘要 |
The invention relates to a radiation curable hot melt composition comprising: a) 20 to 100 wt. % of a radiation curable resin or a mixture of radiation curable resins having a viscosity in the range from 15 to 10,000 mPas in the temperature range from 40 to 150° C., b) 0 to 50 wt. % of a hydroxyfunctional resin or oligomer or a mixture of hydroxyfunctional resins or oligomers, c) 0 to 10 wt. % of a photoinitiator, d) 0 to 50 wt. % of fillers and/or additives, and e) 0 to 40 wt. % of pigment, wherein the total amount of components a) to e) adds up to 100 wt. %. The invention further relates to a process for the coating of a substrate with such radiation curable hot melt composition. In this process the composition is heated to a temperature in the range from 40 to 150° C., is applied to the substrate, and then the coated substrate is exposed to electromagnetic radiation having a wavelength lambda<=500 nm.
|
