Backing plates for sputtering targets

摘要

A backing plate for sputtering targets contains an aluminum alloy having an average coefficient of linear expansion of 23.0x10^-6/° C. or less at temperatures of 25° C. to 100° C. This backing plate prevents warp occurring upon bonding with a target, reduces stress occurring upon film deposition (sputtering) of Al-Nd alloy thin films, saves the flattening process of the warp, is reduced in cracking of a brazing filler metal arranged between the target and the backing plate and thereby enables stable film deposition operation over a long period of time.