Polishing pad

摘要

A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30°C to the storage elastic modulus at 60°C of 2 to 15 and a ratio of the storage elastic modulus at 30°C to the storage elastic modulus at 90°C of 4 to 20 and is made of a polyurethane or polyurethane-urea. This polishing pad suppresses the scratching of the surface to be polished and planarizes the surface efficiently. A polishing pad having a polishing layer containing water-soluble particles can achieve a higher removal rate.