| 摘要 |
A polishing composition includes an abrasive, at least one acid selected from the group consisting of orthophosphoric acid, diphosphoric acid, polyphosphoric acid, metaphosphoric acid, hexametaphosphoric acid, methyl acid phosphate, ethyl acid phosphate, ethyl glycol acid phosphate, isopropyl acid phosphate, phytic acid, and 1-hydroxyethylidene-1,1-diphosphonic acid; at least one salt selected from the group consisting of sodium salts, potassium salts, and lithium salts of an acid selected from orthophosphoric acid, diphosphoric acid, polyphosphoric acid, metaphosphoric acid, hexametaphosphoric acid, methyl acid phosphate, ethyl acid phosphate, ethyl glycol acid phosphate, isopropyl acid phosphate, phytic acid, and 1-hydroxyethylidene-1,1-diphosphonic acid; an oxidizing agent; and water. Also shown is a polishing method using the polishing composition especially for polishing a substrate for a magnetic disk. |
