| 摘要 |
A dicing/die bonding sheet, which comprises a pressure-sensitive adhesive layer containing a compound (A) having a radiation ray curable carbon-carbon double bond in the molecule thereof and exhibiting an iodine value of 0.5 to 20 and at least one compound (B) selected from among a polyisocyanate, a melamine- formaldehyde resin and an epoxy resin, and an adhesive layer containing an epoxy resin (a), a phenol resin (b) having a hydroxyl group equivalent of 150 g/eq or more, an epoxy group-containing acryl copolymer (c) containing 05 to 6 wt % of glycidyl acrylate or glycidyl methacrylate and having a weight average molecular weight of 100,000 or more, a filler (d) and a curing accelerator (e). In a dicing step, the above dicing/die bonding sheet can be used as a dicing tape, and in a pick-up step, a semiconductor element and the adhesive layer can be easily released from the pressure-sensitive adhesive layer for use, and further the adhesive layer exhibits sufficient adhesiveness for use as a die bonding material. |
