发明名称 METHOD FOR MANUFACTURING A MIDPLANE
摘要 A method for manufacturing a mid-plane. a multi-layer board having a connection assembly is provided and a layer with a channel formed therein to define a perimeter of a connector area is provided. The layer is bonded to the multi-layer board such that the connector area overlaps the part of the connection assembly of the multi-layer board. At least a portion of the connector area in the layer is removed to expose the connection assembly of the multi-layer board. A rigid multilayer is also disclosed. The rigid multilayer includes a multi-layer board and a layer. The multi-layer board has a connection assembly. The layer has a channel formed therein to define a perimeter of a connector area. The layer is bonded to the multi-layer board such that the connector area overlaps the connection assembly of the multi-layer board. The connector area can then be removed such as by depth controlled routing. As will be understood by one skilled in the art, the depth tolerance is not critical because the layer is pre-formed with the channel prior to formation of the rigid multi-layer.
申请公布号 EP1647170(A1) 申请公布日期 2006.04.19
申请号 EP20040744201 申请日期 2004.07.08
申请人 HERMKENS, GERALD A.J.;THEELEN, ROGER;SMEETS, MARCEL;SPEETJENS, FRANK;THOOLEN, PETER J.M.;VIASYSTEMS GROUP, INC. 发明人 HERMKENS, GERALD, A., J.;THEELEN, ROGER;SMEETS, MARCEL;SPEETJENS, FRANK;THOOLEN, PETER, J., M.
分类号 H05K3/30;H05K3/46;(IPC1-7):H05K7/14;H05K3/00 主分类号 H05K3/30
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